1 research outputs found
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
The semiconductor industry is experiencing a significant shift from
traditional methods of shrinking devices and reducing costs. Chip designers
actively seek new technological solutions to enhance cost-effectiveness while
incorporating more features into the silicon footprint. One promising approach
is Heterogeneous Integration (HI), which involves advanced packaging techniques
to integrate independently designed and manufactured components using the most
suitable process technology. However, adopting HI introduces design and
security challenges. To enable HI, research and development of advanced
packaging is crucial. The existing research raises the possible security
threats in the advanced packaging supply chain, as most of the Outsourced
Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal
with the increasing demand for semiconductors and to ensure a secure
semiconductor supply chain, there are sizable efforts from the United States
(US) government to bring semiconductor fabrication facilities onshore. However,
the US-based advanced packaging capabilities must also be ramped up to fully
realize the vision of establishing a secure, efficient, resilient semiconductor
supply chain. Our effort was motivated to identify the possible bottlenecks and
weak links in the advanced packaging supply chain based in the US.Comment: 22 pages, 8 figure